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Small Signal Switching Diode
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digital transistor
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SiC Automotive
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PV Diode
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Automotive Rectifier
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Protection Diode

Transient Voltage Suppressor
Thyristor Surge Suppressor
ESD Protection Diode
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Thyristor
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Automotive Protection Diode
Transient Voltage Suppressor ESD Protection Diode Power Zener Diode

Small Signal

Small Signal Switching Diode
Small Signal Schottky Diode
Small Signal Zener Diode
Small Signal Transisitor
Small Signal Digital
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Power Transistor

Automotive
Small Signal
Small Signal Switching Diode Small Signal Schottky Diode Small Signal Zener Diode Small Signal Transisitor Power Transistor Small Signal Digital
Transisitor

MOSFET

ALL MOSFET
Automotive MOSFET

High-voltage
MOSFET(500V-1000V)
SJ MOSFET SiC MOSFET Planner MOSFET

Low & Medium Voltage
MOSFET(12V-400V)
N-Channel MOSFET P-Channel MOSFET

NP MOSFET(12V-300V)
Complementary MOSFET Dual N-Channel MOSFET Dual P-Channel MOSFET Half-bridge MOSFET

IGBT

IGBT Module
IGBT Discrete
IGBT Automotive

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Rectifier Diodes Module
Fast Recovery Module
Schottky Module
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Thyristor / Rectifier
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Fast/Phase-controlled
Thyristor

SiC

SiC Schottky Diode
SiC MOSFET
SiC Schottky
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SiC MOSFET
Modules
SiC Automotive
Schottky Diode
SiC Automotive
MOSFET

4/5″wafer

STD Chip
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TVS Chip
HVB High Voltage Module Chip
Automotive Electronics Chip

6″wafer

TSBD Chip
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FRED Chip
LBD Chip
PMBD Chip
ESD Chip

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LOAD Switches
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Shunt Regulator
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SOD-123HE SMD Type TVS Products

SOD-123HE SMD Type TVS Products Back

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Introduction 1.Ultra-thin package, can be applied to miniaturized, thin circuit;
2.The metal cooling surface on the bottom of the package is large, heat dissipation performance is excellent;
3. It uses environmentally friendly materials, in line with RoHS standards;
4. Widely used in secondary rectifier circuit, converter, continuous current diode, AC/DC power supply protection;

Features 1.Excellent heat dissipation performance: the back Pad area is large, compared with the change of SOD-123FL/SMAF heat dissipation path, the original pin heat dissipation is changed to the back metal plate Pad heat dissipation, the metal heat dissipation area is increased by 150%, the instant heat dissipation performance is better, which makes it can withstand greater energy impact and have stronger lightning strike ability
2. Thin package shape: thinner than SOD-123FL package, 20% lower than SOD-123FL package thickness, 30% lower than SMAF body thickness, 20% shorter length, body thickness thinning to meet the development trend of thin packaging

SPECIFICATION

SM4FE SERIES SMFE SERIES

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